Wafer-Level AuSn/Pt Solid–Liquid Interdiffusion Bonding
نویسندگان
چکیده
منابع مشابه
Wafer-level Cu-Cu bonding technology
0026-2714/$ see front matter 2011 Elsevier Ltd. A doi:10.1016/j.microrel.2011.04.016 ⇑ Corresponding author. E-mail address: [email protected] (K.-N. C Semiconductor industry currently utilizes copper wafer bonding as one of key technologies for 3D integration. This review paper describes both science and technology of copper wafer bonding with regard to present applications. The classifi...
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ژورنال
عنوان ژورنال: IEEE Transactions on Components, Packaging and Manufacturing Technology
سال: 2018
ISSN: 2156-3950,2156-3985
DOI: 10.1109/tcpmt.2017.2780102